Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFPs-Reference-Cited by-同舟云学术

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Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFPs

Published:1996-05 Issue:2 Volume:19 Page:296-300
ISSN:1070-9894
Container-title:IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
language:
Short-container-title:IEEE Trans. Comp., Packag., Manufact. Technol. B

Author:

Kelly G.,Lyden C.,Lawton W.,Barrett J.,Saboui A.,Pape H.,Peters H.J.B.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering

Link

http://xplorestaging.ieee.org/ielx4/96/10657/00496032.pdf?arnumber=496032

Cited by 44 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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3. Investigation of the Influence of Dam and Fill Encapsulating Material Shrinkage on a Semiconductor Substrate Warpage;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10

4. Warpage and residual stress analyses of post-mold cure process of IC packages;The International Journal of Advanced Manufacturing Technology;2022-11-28

5. Prediction Models for Distortions and Residual Stresses in Thermoset Polymer Laminates: An Overview;Journal of Manufacturing and Materials Processing;2019-10-11

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