Simultaneous Measurement of Effective Chemical Shrinkage and Modulus Evolutions During Polymerization
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Aerospace Engineering
Link
http://link.springer.com/content/pdf/10.1007/s11340-010-9410-y.pdf
Reference63 articles.
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2. Yang DG, Ernst LJ, van’t Hof C et al () Vertical die crack stresses of Flip Chip induced in major package assembly processes. 1533-1538
3. Oota K, Saka M (2001) Cure shrinkage analysis of epoxy molding compound. Polym Eng Sci 41(2):1373–1379
4. Lu D, Wong CP (2009) Materials for advanced packaging. Springer-Verlag New York
5. Cook WD, Forrest M, Goodwin AA (1999) A simple method for the measurement of polymerization shrinkage in dental composites. Dent Mater 15(6):447–449
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