Author:
Yang D.G.,Ernst L.J.,van `t Hof C.,Kiasat M.S.,Bisschop J.,Janssen J.,Kuper F.,Liang Z.N.,Schravendeel R.,Zhang G.Q.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
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4. Curing shrinkage and residual stress in viscoelastic thermosetting resins and composites;Kiasat,2000
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