Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles-Reference-Cited by-同舟云学术

Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles

Published:2023-01-25 Issue:8 Volume:15 Page:11024-11032
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Park Seong Yeon¹,On Seung Yoon¹,Kim Junmo¹,Lee Jeonyoon²^ORCID,Kim Taek-Soo¹^ORCID,Wardle Brian L.³⁴^ORCID,Kim Seong Su¹^ORCID

Affiliation:

1. Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon305-701, Republic of Korea

2. Department of Aerospace Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon305-701, Republic of Korea

3. Department of Aeronautics and Astronautics, Massachusetts Institute of Technology, 77 Massachusetts Ave, Cambridge, Massachusetts02139, United States

4. Department of Mechanical Engineering, Massachusetts Institute of Technology, 77 Massachusetts Ave, Cambridge, Massachusetts02139, United States

Funder

National Research Foundation of Korea

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.2c21229

Reference46 articles.

1. Materials and mechanics issues in flip-chip organic packaging

2. A review of 3-D packaging technology

3. Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal Management

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