Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements-Reference-Cited by-同舟云学术

Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements

Published:2023-08-03 Issue:32 Volume:15 Page:38750-38758
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Park Seong Yeon¹,On Seung Yoon¹,Kim Junmo¹,Lee Jeonyoon²^ORCID,Kim Taek-Soo¹^ORCID,Wardle Brian L.³⁴^ORCID,Kim Seong Su¹^ORCID

Affiliation:

1. Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 305-701, Republic of Korea

2. Department of Aerospace Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 305-701, Republic of Korea

3. Department of Aeronautics and Astronautics, Massachusetts Institute of Technology, 77 Massachusetts Avenue, Cambridge, Massachusetts 02139, United States

4. Department of Mechanical Engineering, Massachusetts Institute of Technology, 77 Massachusetts Avenue, Cambridge, Massachusetts 02139, United States

Funder

National Research Foundation of Korea

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.3c06145

Reference34 articles.

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2. Zheng, J.; Zhang, Z.; Chen, Y.; Shi, J. 3D stacked package technology and its application prospects. In 2009 International Conference on New Trends in Information and Service Science; IEEE, 2009; pp 528–533.

3. Hong, J.; Choi, K.; Oh, D.; Park, S.; Shao, S.; Wang, H.; Niu, Y. Design guideline of 2.5 D package with emphasis on warpage control and thermal management. 2018 IEEE 68th Electronic Components and Technology Conference (ECTC); IEEE, 2018; pp 682–692.

4. Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips

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