3D Stacked Package Technology and Its Application Prospects-Reference-Cited by-同舟云学术

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3D Stacked Package Technology and Its Application Prospects

Published:2009-06 Issue: Volume: Page:
ISSN:
Container-title:2009 International Conference on New Trends in Information and Service Science
language:
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Author:

Zheng Jianyong,Zhang Zhisheng,Chen Yigao,Shi Jinfei

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5260408/5260409/05260883.pdf?arnumber=5260883

Cited by 17 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements;ACS Applied Materials & Interfaces;2023-08-03

2. Survey of Reliability Research on 3D Packaged Memory;Electronics;2023-06-17

3. Prediction and Analysis of Radiated EMI From a Wafer-Level Package Based on IC Source Modeling;IEEE Transactions on Electromagnetic Compatibility;2023

4. Evaluation of Cost-Effective Flexible High-Speed Data Exchange Links for Heterogeneously Integrated Multi-Chip Modules and Boards;Journal of Nanoelectronics and Optoelectronics;2022-05-01

5. Automated Probe-Mark Analysis for Advanced Probe Technology Characterization;IEEE Design & Test;2021-10

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