Numerical investigations on the effects of different cooling periods in reflow-soldering process
Author:
Publisher
Springer Science and Business Media LLC
Subject
Fluid Flow and Transfer Processes,Condensed Matter Physics
Link
http://link.springer.com/content/pdf/10.1007/s00231-015-1506-6.pdf
Reference24 articles.
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2. Florian S, Denis K, Jörg F (2009) Influences on the reflow soldering process by components with specific thermal properties. Circuit World 35(3):35–42
3. Lau CS, Abdullah MZ, Che Ani F (2012) Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process. Solder Surf Mt Technol 24(2):77–91
4. Salam B, Virseda C, Da H, Ekere NN, Durairaj R (2003) Reflow profile study of the Sn-Ag-Cu solder. Solder Surf Mt Technol 16(1):27–34
5. Tsai TN (2009) Modeling and optimization of reflow thermal profiling operation: a comparative study. J Chin Inst Ind Eng 26:480–492
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