Reflow profile study of the Sn‐Ag‐Cu solder-Reference-Cited by-同舟云学术

Reflow profile study of the Sn‐Ag‐Cu solder

Published:2004-04 Issue:1 Volume:16 Page:27-34
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Salam B.,Virseda C.,Da H.,Ekere N.N.,Durairaj R.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference7 articles.

1. Frear, D.R. (1991), “Solder mechanics: a state‐of‐the‐art assessment”, TMS, Minerals Metals Materials, Pennsylvania, USA, pp. 29‐104.

2. Optimizing the reflow profile via defect mechanism analysis

3. Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

4. Skidmore, T. and Waiters, K. (2000), “Optimizing solder joint quality‐lead free”, Circuits Assembly, pp. 17‐22.

5. Suganuna, H. and Tamanaha, A. (2001), “Reflow technology”, SMT Magazine, pp. 65‐70.

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