Author:
Gang Gao Jin,Ping Wu Yi,Ding Han,Hong Wan Nian
Abstract
PurposeThis paper aims to offer a convenient method to develop an oven recipe for a specific soldering profile in a reflow process. The method is devised to quickly achieve proper profile shape and heating factor Qη, a measure of success for high reliability of the solder joints reflowed.Design/methodology/approachAn in‐depth analysis of the heating mechanism and some experiments of the reflow soldering process are performed to research on how to realize a specific shape reflow profile were conducted.FindingsHeating mechanism analysis and experiments demonstrate that the combinatorial parameters based method is feasible to do thermal profiling.Research limitations/implicationsThe mapping function among a particular configured PCBA, an oven used, a target reflow profile and an optimal range of the heating factor should be further established for fast and reliable production of reflow soldering.Practical implicationsProvides a methodology for designing an oven recipe for reflow soldering production.Originality/valueAn oven recipe can be quickly attained with the approach established in this paper, facilitating the formation of solder joints with high reliability during the reflow soldering process.
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science
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