Metallurgical reactions at the interface of Sn/Pb solder and electroless copper-plated AlN substrate
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Engineering
Link
http://xplorestaging.ieee.org/ielx4/96/9089/00404113.pdf?arnumber=404113
Cited by 19 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Effects of work-hardening and post thermal-treatment on tensile behaviour of solder-affected copper;Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications;2022-10-11
2. Cu to Cu direct bonding at low temperature with high density defect in electrodeposited Cu;Applied Surface Science;2021-06
3. On the investigation of reuse potential of SnPb-solder affected copper subjected to work-hardening and thermal ageing;Materials Characterization;2021-02
4. Effects of diamond nanoparticles reinforcement into lead-free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process;Materials & Design;2015-10
5. Effects of pad metallization on the low cycle fatigue characteristics of Sn-based solder joints;International Journal of Fatigue;2013-03
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