A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints-Reference-Cited by-同舟云学术

A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints

Author:

Lambrinou Konstantina,Maurissen Wout,Limaye Paresh,Vandevelde Bart,Verlinden Bert,De Wolf Ingrid

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

Reference47 articles.

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5. F. Song, S.W.R. Lee, K. Newman, B. Sykes, and S. Clark, Proc. 57th Electron. Comp. Technol. Conf. (Reno, NV, USA, May–June 2007), pp. 364–372.

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