Dynamic properties of solders and solder joints-Reference-Cited by-同舟云学术

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Dynamic properties of solders and solder joints

Published:2003-09 Issue: Volume:110 Page:477-482
ISSN:1155-4339
Container-title:Journal de Physique IV (Proceedings)
language:
Short-container-title:J. Phys. IV France

Author:

Siviour C. R.,Williamson D. M.,Palmer S. J.P.,Walley S. M.,Proud W. G.,Field J. E.

Publisher

EDP Sciences

Subject

General Physics and Astronomy

Link

http://jp4.journaldephysique.org/10.1051/jp4:20020739/pdf

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The damped dynamics of printed circuit board and analysis of distorted and deformed half-sine excitation;Microelectronics Reliability;2009-08

2. A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints;Journal of Electronic Materials;2009-05-28

3. High strain rate compression behavior for Sn–37Pb eutectic alloy, lead-free Sn–1Ag–0.5Cu and Sn–3Ag–0.5Cu alloys;Microelectronics Reliability;2009-03

4. A review of board level solder joints for mobile applications;Microelectronics Reliability;2008-11

5. High strain rate testing of solder interconnections;Soldering & Surface Mount Technology;2006-04

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