The damped dynamics of printed circuit board and analysis of distorted and deformed half-sine excitation-Reference-Cited by-同舟云学术

The damped dynamics of printed circuit board and analysis of distorted and deformed half-sine excitation

Published:2009-08 Issue:8 Volume:49 Page:916-923
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Wong E.H.,Mai Yiu-Wing

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference16 articles.

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2. Wong EH, Lim KM, Lee N, Seah S, Koh C, Wang J. Drop impact test – mechanics and physics of failure. In: Proceedings of 4th electronic packaging technology conference; 2002. p. 327–33.

3. Dynamics of package cushioning;Mindlin;Bell Syst Tech J,1946

4. Engineering vibrations;Jacobsen,1958

5. Transient response to step and pulse functions;Ayre,1995

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