1. Wong EH, Wong CK. Tri-layer structures subjected to combined temperature and mechanical loadings, IEEE Trans Comp Packag Technol; in press.
2. Field JE, et al. Spall, quasi-static and high strain rate shear strength data for electronic solder materials, Interim Report No. SP 1113; 2002, Drop-Impact Research Project between Institute of Microelectronics, University of Singapore, and University of Cambridge.
3. Dynamic properties of solders and solder joints;Siviour;J Phys IV France,2003
4. Shouji T, et al. Study of interface reaction phenomena between Pb-free solder and Cu. In: Proceedings of the 16th JIEP annual meeting; 2002. p. 97–8 [in Japanese].
5. Wu J, Song G, Yeh C-P, Wyatt K. Drop/impact simulation and test validation of telecommunication products. In: International society conference on thermal phenomena; 1998. p. 330–36.