Research on the Reliability of Interconnected Solder Joints of Copper Pillars under Random Vibration

Author:

Yu ShifengORCID,Dai Junjie,Li Junhui

Funder

National Natural Science Foundation of China’s joint fund for regional innovation and development

Publisher

Springer Science and Business Media LLC

Reference24 articles.

1. C¸ELİK, M. and GENC¸, C. (2008) Mechanical fatigue of an electronic component under random vibration. Fatigue Fract Eng Mater Struct 31:505–516

2. Doranga S, Schuldt M, Khanal M (2022) Effect of Stiffening the Printed Circuit Board in the Fatigue Life of the Solder Joint. Materials 15:6208

3. Doranga S, Xie D, Lee J, Zhang A, Shi X, Khaldarov V (2023) A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique. ASME J Electron Packag 145(3)

4. Gharaibeh MA, Su QT, Pitarresi JM, Anselm M (2013) Board-Level Drop Test: Comparison of Two ANSYS Modeling Approaches and Correlation with Testing[C]. Adv Res Electron Assy (AREA) Consortium

5. Gharaibeh MA, Su QT, Pitarresi JM, Anselm M (2013) Modeling and Characterization for Vibration [C]. Adv Res Electron Assy (AREA) Consortium

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