Funder
National Natural Science Foundation of China’s joint fund for regional innovation and development
Publisher
Springer Science and Business Media LLC
Reference24 articles.
1. C¸ELİK, M. and GENC¸, C. (2008) Mechanical fatigue of an electronic component under random vibration. Fatigue Fract Eng Mater Struct 31:505–516
2. Doranga S, Schuldt M, Khanal M (2022) Effect of Stiffening the Printed Circuit Board in the Fatigue Life of the Solder Joint. Materials 15:6208
3. Doranga S, Xie D, Lee J, Zhang A, Shi X, Khaldarov V (2023) A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique. ASME J Electron Packag 145(3)
4. Gharaibeh MA, Su QT, Pitarresi JM, Anselm M (2013) Board-Level Drop Test: Comparison of Two ANSYS Modeling Approaches and Correlation with Testing[C]. Adv Res Electron Assy (AREA) Consortium
5. Gharaibeh MA, Su QT, Pitarresi JM, Anselm M (2013) Modeling and Characterization for Vibration [C]. Adv Res Electron Assy (AREA) Consortium
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