Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni-Reference-Cited by-同舟云学术

Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni

Published:2002-06 Issue:6 Volume:31 Page:584-590
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Ho C. E.,Tsai R. Y.,Lin Y. L.,Kao C. R.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-002-0129-0.pdf

Reference10 articles.

1. K.-W. Moon, W.J. Boettinger, U.R. Kattner, F.S. Biancaniello, and C.A. Handwerker, J. Electron. Mater. 29, 1122 (2000).

2. Workshop on Modeling and Data Needs for Lead-Free Solders (Meeting Report presented at the National Electronics Manufacturing Initiative, New Orleans, LA, 15 February 2001).

3. C.E. Ho, Y.L. Lin, and C.R. Kao, Chem. Mater., 14, 949 (2002).

4. S.K. Kang, R.S. Rai, and S. Purushothaman, J. Electron. Mater. 25, 1113 (1996).

5. H.D. Blair, T.Y. Pan, and J.M. Nicholson, Proceedings of the 1998 Electronic Components and Technology Conference, (Piscataway, NJ: IEEE, 1998), p. 259.

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