Strong Effect of Cu Concentration on the Reaction between Lead-Free Microelectronic Solders and Ni
Author:
Affiliation:
1. Department of Chemical & Materials Engineering, National Central University, Chungli City, Taiwan
Publisher
American Chemical Society (ACS)
Subject
Materials Chemistry,General Chemical Engineering,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/cm010639h
Reference5 articles.
1. Bradley, E.; Bath, J.; Whitten, G.; Chada, S.Adv. Packag.2000, Feb, 34.
2. Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders
3. Reactions of lead-free solders with CuNi metallizations
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