Effects of Pd addition on Au stud bumps/Al pads interfacial reactions and bond reliability-Reference-Cited by-同舟云学术

Effects of Pd addition on Au stud bumps/Al pads interfacial reactions and bond reliability

Published:2004-10 Issue:10 Volume:33 Page:1210-1218
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Kim Hyoung-Joon,Cho Jong-Soo,Park Yong-Jin,Lee Jin,Paik Kyung-Wook

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-004-0124-8.pdf

Reference14 articles.

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3. C. Simons, L. Schrapler, and G. Herklotz, Gold Bull. 33, 89 (2000).

4. G. Rui, J. Xuan, L. Baoguo, and B. Lizhi, Rare Met. 14, 203 (1995).

5. G. Humpston and D.M. Jacobson, Mater. Technol. 6–7, p. 25 (1993).

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