Interfacial Reaction Characteristics of Au Stud/Sn/Cu Pillar Bump During Annealing and Current Stressing
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Published:2015-11-01
Issue:11
Volume:15
Page:8725-8730
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ISSN:1533-4880
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Container-title:Journal of Nanoscience and Nanotechnology
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language:en
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Short-container-title:j nanosci nanotechnol
Author:
Kim Jun-Beom,Lee Byeong-Rok,Kim Sung-Hyuk,Park Jong-Myeong,Park Young-Bae
Publisher
American Scientific Publishers
Subject
Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering