Doped and low-alloyed gold bonding wires-Reference-Cited by-同舟云学术

Doped and low-alloyed gold bonding wires

Published:2000-09 Issue:3 Volume:33 Page:89-96
ISSN:0017-1557
Container-title:Gold Bulletin
language:en
Short-container-title:Gold Bull

Author:

Simons Ch,Schräpler L,Herklotz G

Publisher

Springer Science and Business Media LLC

Subject

Inorganic Chemistry,General Materials Science

Link

http://www.springerlink.com/index/pdf/10.1007/BF03215484

Reference34 articles.

1. AVT Report 4, Technologie des Drahtbondens, Germany, August 1991

2. ‘High Technology Bonding Tools’, Gaiser Tool Company, Ventura, California, 1989

3. W. Kohl, ‘The Interaction of Material and Machine Parameters in Thermosonic Bonding’, translation of a reprint from ‘Der Elektroniker’ Issue 6/1990, AT-Fachverlag, Stuttgart, Germany, 1991

4. Merkblatt DVS 2810 Drahtbonden, (instructional leaflet, wire bonding), Germany, 1992

5. S. Tomiyama and Y. Fukni,Gold Bull., 1982,15 (2), 43

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