Gold bonding wire for semiconductor applications-Reference-Cited by-同舟云学术

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Gold bonding wire for semiconductor applications

Published:1982-06 Issue:2 Volume:15 Page:43-50
ISSN:0017-1557
Container-title:Gold Bulletin
language:en
Short-container-title:Gold Bull

Author:

Tomiyama Susumu,Fukui Yasuo

Publisher

Springer Science and Business Media LLC

Subject

Inorganic Chemistry,General Materials Science

Link

http://www.springerlink.com/index/pdf/10.1007/BF03214605

Reference10 articles.

1. B. Brenner,U.S. Patent 3,272,625 (1966)

2. T.H. Ramsey,Solid State Technol., 1973,16, (10), 43–47

3. B.L. Gehman,Solid Stale Technol., 1980,23, (3), 84–91

4. W.S. Rapsoo and T. Groenewald, ‘Gold Usage’, Academic Press, London, 1978

5. M. Bonkohara,U.S. Patent 4,080,485 (1978)

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Corrosion of Gold by a Nanoscale Gold and Copper Beltlike Structure;The Journal of Physical Chemistry C;2019-07-22

2. Effects of alloying elements on microstructure and thermal aging properties of Au bonding wire;Microelectronics Reliability;2011-12

3. Relationship between microstructure homogeneity and bonding stability of ultrafine gold wire;Gold Bulletin;2011-11-17

4. A numerical approach on the inclusion effects in ultrafine gold wire drawing process;Engineering Failure Analysis;2011-07

5. Investigation on cold-drawn gold bonding wire with serial and reverse-direction drawing;Materials Science and Engineering: A;2006-09

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