Author:
Kim Hyung-Giun,Lee Taeg-Woo,Jeong Eun-Kyun,Kim Won-Yong,Lim Sung-Hwan
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
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4. A brief review of selected aspects of the materials science of ball bonding;Breach;Microelectron Reliab,2010
5. Overview of wire bonding using copper wire or insulated wire;Zhong;Microelectron Reliab,2011
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