Phase-field crystal simulation of the evolution of voids in polycrystalline Au–Al bonds with elastic interaction and the Kirkendall effect

Author:

Wu Xinwei,Chen Mingyang,Ke LiaoliangORCID

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

General Physics and Astronomy,Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference50 articles.

1. Au/Al wire bond interface resistance degradation rate simulations;Ahmad;IEEE Trans. Device Mater. Reliab.,2019

2. Melting at dislocations and grain boundaries: a phase field crystal study;Berry;Phys. Rev. B,2008

3. Defect stability in phase-field crystal models: stacking faults and partial dislocations;Berry;Phys. Rev. B,2013

4. Grain boundary and particle interaction: enveloping and pass-through mechanisms studied by 3D phase field crystal simulations;Blixt;Mater. Des.,2022

5. Wire-bond void formation during high temperature aging;Chang;IEEE Trans. Compon. Packaging Technol.,2004

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