Relationship between microstructure homogeneity and bonding stability of ultrafine gold wire-Reference-Cited by-同舟云学术

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Relationship between microstructure homogeneity and bonding stability of ultrafine gold wire

Published:2011-11-17 Issue:4 Volume:44 Page:231-237
ISSN:2190-7579
Container-title:Gold Bulletin
language:en
Short-container-title:Gold Bull

Author:

Son Seoung-Bum,Roh Hyunchul,Kang Suk Hoon,Chung Hee-Suk,Kim Do Hyun,Choi Yong Seok,Cho Jong Soo,Moon Jeong-Tak,Oh Kyu Hwan

Publisher

Springer Science and Business Media LLC

Subject

Inorganic Chemistry,General Materials Science

Link

http://www.springerlink.com/index/pdf/10.1007/s13404-011-0035-4

Reference27 articles.

1. Kang SH, Jung HS, Bang WH et al (2005) High tensile strength of drawn gold. Mater Sci Forum 495:907–912

2. Tomiyama S, Fukui Y (1982) Gold bonding wire for semiconductor applications. Gold Bull 15:43–50

3. Cho JH, Rollett AD, Cho JS, Park YJ, Park SH, Oh KH (2006) Investigation on cold-drawn gold bonding wire with serial and reverse-direction drawing. Mater Sci Eng, A 432:202–215

4. Yu C-F, Chan C-M, Chan L-C, Hsieh K-C (2011) Cu wire bond microstructure analysis and failure mechanism. Microelectron Reliab 51:119–124

5. Chen J, Lai YS, Wang YW, Kao CR (2011) Investigation of growth behavior of Al–Cu intermetallic compounds in Cu wire bonding. Microelectron Reliab 51:125–129

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