Author:
Chen Jiunn,Lai Yi-Shao,Wang Yi-Wun,Kao C.R.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference51 articles.
1. A brief review of selected aspects of the materials science of ball bonding;Breach;Microelectron Reliab,2010
2. Development of copper wire bonding application technology;Toyozawa;IEEE Trans Compon Hybrids Manuf Technol,1990
3. A comparison of copper and gold wire bonding on integrated circuit devices;Khoury;IEEE Trans Compon Hybrids Manuf Technol,1990
4. Tan J, Toh BH, Ho HM. Modelling of free air ball for copper wire bonding. In: Proceedings of the 6th electronics packaging technology conference, Singapore; 2004. p. 711–7.
5. Hang C, Wang C, Shi M, Wu X, Wang H. Study of copper free air ball in thermosonic copper ball bonding. Proceedings of 6th international conference on electronic packaging technology. Shanghai, China; 2005. p. 414–8.
Cited by
41 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献