Effect of substrate orientation on critical thickness of Cu thin films
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electronic, Optical and Magnetic Materials
Link
http://link.springer.com/content/pdf/10.1007/s13391-011-0170-3.pdf
Reference16 articles.
1. J. Zhang, J. Y. Zhang, G. Liu, Y. Zhao, J. Sun, Thin Solid Films 517, 2936 (2009).
2. C. M. Tan, A. Roy, Mater. Sci. Eng. R 58, 1 (2007).
3. F. C. Frank and J. H. van der Merwe, Proc. R. Soc. London A 198, 205 (1949).
4. S. D. Wang, Mater. Sci. Eng. A 311, 114 (2001).
5. S. M. Hu, J. Appl. Phys. 69, 7901 (1991).
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