Author:
Cui Hui-Wang,Jiu Jin-Ting,Sugahara Tohru,Nagao Shijo,Suganuma Katsuaki,Uchida Hiroshi
Publisher
Springer Science and Business Media LLC
Subject
Electronic, Optical and Magnetic Materials
Reference23 articles.
1. Y. Li, K. S. Moon, and C. P. Wong, Science 308, 1419 (2005).
2. D. Lu and C. P. Wong, In: Advanced Flip Chip Packaging, p. 201, H. M. Tong, Y. S. Lai, and C. P. Wong (eds.), Springer, New York, USA (2013).
3. H. W. Cui, J. T. Jiu, S. Nagao, T. Sugahara, K. Suganuma, H. Uchida, and K. A. Schroder, RSC Adv. 4, 15914 (2014).
4. H. W. Cui, Q. Fan, D. S. Li, and X. Tang, J. Adhes. 89, 19 (2013).
5. H. W. Cui, Q. Fan, and D. S. Li, Polym. Int. 62, 1644 (2013).
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