Ultra-fast photonic curing of electrically conductive adhesives fabricated from vinyl ester resin and silver micro-flakes for printed electronics-Reference-Cited by-同舟云学术

Ultra-fast photonic curing of electrically conductive adhesives fabricated from vinyl ester resin and silver micro-flakes for printed electronics

Published:2014 Issue:31 Volume:4 Page:15914-15922
ISSN:2046-2069
Container-title:RSC Adv.
language:en
Short-container-title:RSC Adv.

Author:

Cui Hui-Wang¹²³,Jiu Jin-Ting¹²³,Nagao Shijo¹²³,Sugahara Tohru¹²³,Suganuma Katsuaki¹²³,Uchida Hiroshi⁴⁵⁶,Schroder Kurt A.⁷⁸⁹

Affiliation:

1. Institute of Scientific and Industrial Research

2. Osaka University

3. Ibaraki, Japan

4. Institute for Polymers and Chemicals Business Development Center

5. Showa Denko K. K.

6. Ichihara, Japan

7. NCC Nano

8. LLC

9. Austin, USA

Abstract

Electrically conductive vinyl ester resin–silver micro-flake adhesives, combined with intense pulsed light, present ultra-fast photonic curing within a second.

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2014/RA/C4RA00292J

Reference54 articles.

1. Electronics Without Lead

2. D. Lu and C. P.Wong , Conductive adhesives for flip-chip applications , in Advanced Flip Chip Packaging , ed. H. M. Tong , Y. S. Lai and C. P. Wong , Springer , New York, US , 2013 , pp. 201–261

3. Surfactant-Free Synthesis of Copper Particles for Electrically Conductive Adhesive Applications

4. Electrochemical migration behavior of Ag-plated Cu-filled electrically conductive adhesives

5. Effects of coupling agents on the properties of epoxy-based electrically conductive adhesives

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