Formulation and Characterization of Electrically Conductive Adhesives for Electronic Packaging-Reference-Cited by-同舟云学术

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Formulation and Characterization of Electrically Conductive Adhesives for Electronic Packaging

Published:2013-01 Issue:1 Volume:89 Page:19-36
ISSN:0021-8464
Container-title:The Journal of Adhesion
language:en
Short-container-title:The Journal of Adhesion

Author:

Cui Hui-wang,Fan Qiong,Li Dong-sheng,Tang Xin

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

http://www.tandfonline.com/doi/pdf/10.1080/00218464.2012.725621

Reference29 articles.

1. An Overview of Advances in Conductive Adhesive Joining Technology for Electronics Applications

2. Overview of conductive adhesive interconnection technologies for LCDs

3. Electronics Without Lead

4. Development of conductive adhesives for solder replacement

5. Reliability assessment of isotropically conductive adhesive joints in surface mount applications

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1. Near‐Theoretical Thermal Conductivity Silver Nanoflakes as Reinforcements in Gap‐Filling Adhesives;Advanced Materials;2023-06-20

2. Improvement in the Thermal Conductivity of Silver Epoxy Adhesive by Treating with Water Vapor;Polymers;2023-05-17

3. Alumina-Coated Cu@Reduced Graphene Oxide Microspheres as Enhanced Antioxidative and Electrically Insulating Fillers for Thermal Interface Materials with High Thermal Conductivity;ACS Applied Electronic Materials;2019-06-19

4. How interface compatibility affects conductivity evolution of silver nanobelts-filled electrically conductive composites during cure and post-treatments;Physical Chemistry Chemical Physics;2018

5. Core–shell Cu@rGO hybrids filled in epoxy composites with high thermal conduction;Journal of Materials Chemistry C;2018

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