Degradation Mechanism of Interfacial Adhesion between Screen-Printed Ag/Polyimide in Temperature/Humidity Environment
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electronic, Optical and Magnetic Materials
Link
http://link.springer.com/content/pdf/10.1007/s13391-021-00272-1.pdf
Reference33 articles.
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3. Kim, J.W., Duraisamy, N., Lee, T.M., Kim, I., Choi, K.H.: Screen printed silver top electrode for efficient inverted organic solar cells. Mate. Re. Bull. 70, 412 (2015)
4. Kim, A., Lee, S.J., Choi, E., Pyo, S.G.: Microstructural evolution of wet deposited nickel interfacial phases on phosphorus doped silicon surface. Met. Mater. Int. 20, 775 (2014)
5. Noh, B.I., Jung, S.B.: Effect of Ni–Cr layer on adhesion strength of flexible copper clad laminate. J. Electron. Mater. 38, 46 (2009)
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