Controlling intermetallic compound growth in SnAgCu/Ni-P solder joints by nanosized Cu6Sn5 addition-Reference-Cited by-同舟云学术

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Controlling intermetallic compound growth in SnAgCu/Ni-P solder joints by nanosized Cu6Sn5 addition

Published:2006-03 Issue:3 Volume:35 Page:486-493
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Kao Szu-Tsung,Lin Yung-Chi,Duh Jenq-Gong

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02690536.pdf

Reference20 articles.

1. S. Choi, T.R. Bieler, J.P. Lucas, and K.N. Subramanian, J. Electron. Mater. 28, 1209 (1999).

2. A.J. Sunwoo, J.W. Morris, Jr., and G.K. Lucey, Jr., Metall. Trans. A 23, 1323 (1992).

3. J.H. Lee, D. Park, J.T. Moon, Y.H. Lee, D.H. Shin, and Y.S. Kim, J. Electron. Mater. 29, 1264 (2000).

4. D. Lin, G.X. Wang, T.S. Srivatsan, M.A. Hajri, and M. Petraroli, Mater. Lett. 53, 333 (2002).

5. Y. Wu, J.A. Sees, C. Pouraghabagher, L.A. Foster, J.L. Marshall, E.G. Jacobs, and R.F. Pinizzotto, J. Electron. Mater. 22, 769 (1993).

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3. Characterization of reflow soldering at a peak temperature of 215 °C using a Bi-coated Sn-3.0Ag-0.5Cu solder ball;Applied Surface Science;2018-10

4. Highly spherical, mono-sized SnAgCu droplets by pulsated orifice ejection method;MRS Communications;2017-08-14

5. Design and performance of Ag nanoparticle-modified graphene/SnAgCu lead-free solders;Materials Science and Engineering: A;2016-06

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