Reliability of composite solder bumps produced by an in-situ process-Reference-Cited by-同舟云学术

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Reliability of composite solder bumps produced by an in-situ process

Published:2000-10 Issue:10 Volume:29 Page:1264-1269
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Lee Jong-Hyun,Park Daejin,Moon Jong-Tae,Lee Yong-Ho,Shin Dong Hyuk,Kim Yong-Seog

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-000-0022-7.pdf

Reference25 articles.

1. K.G. Schmitt-Thomas and S. Wedg, Brazing and Soldering 11, 27 (1986).

2. R.N. Wild, Welding J. (Res. Suppl.) 51, 521s (1972).

3. W.M. Wolverton, Brazing and Soldering 12, 33 (1987).

4. D.R. Frear and W.B. Jones, Proc. NEPCON West 90, 1324 (1990).

5. D.R. Frear, Solder Mechanics (A State of the Art Assessment), ed. D.R. Frear, W.B. Jones and K.R. Kinsman (Warrendale, PA: TMS, 1991), p. 191.

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