Effect of Moisture Content on Crack Formation During Reflow Soldering of Ball Grid Array (BGA) Component
Author:
Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-030-70917-4_29
Reference10 articles.
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4. Ismail, N., Jalar, A., Abu Bakar, M., Ismail, R., Ibrahim, S.: Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu. Solder. Surf. Mount Technol. 32(3), 157–164 (2020)
5. Che Ani, F., Jalar, A., Saad, A.A., Khor, C.Y., Abas, M.A., Bachok, Z., Othman, N.K.: Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly. Solder. Surf. Mount Technol. 31(2), 109–124 (2019)
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2. Thermal Management on the Solder Joints of Adjacent Ball Grid Array (BGA) Rework Components Using Laser Soldering;Springer Proceedings in Physics;2023
3. THERMAL-INDUCED DAMAGE ON SOLDER JOINTS OF HIGH-DENSITY ADJACENT BALL GRID ARRAY COMPONENTS DURING THE REWORK PROCESS;Jurnal Teknologi;2022-10-31
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