Interfacial reaction and microstructure between the Sn3Ag0.5Cu solder and Cu–Co dual-phase substrate-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Interfacial reaction and microstructure between the Sn3Ag0.5Cu solder and Cu–Co dual-phase substrate

Published:2018-06-11 Issue:7 Volume:124 Page:
ISSN:0947-8396
Container-title:Applied Physics A
language:en
Short-container-title:Appl. Phys. A

Author:

Li Chao,Hu Xiaowu,Jiang Xiongxin,Li Yulong

Funder

Nature Science Foundation of China

Nature Science Foundation of Jiangxi Province

Key project of the Nature Science Foundation of Jiangxi Province

Postgraduate Innovation special founds of Jiangxi province

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science,General Chemistry

Link

http://link.springer.com/article/10.1007/s00339-018-1907-8/fulltext.html

Reference38 articles.

1. H.T. Lee, H.S. Lin, C.S. Lee, P.W. Chen, Reliability of Sn-Ag-Sb lead-free solder joints. Mater. Sci. Eng. A. 407, 36–44 (2005)

2. M.N. Islam, Y.C. Chan, M.J. Rizvi, W. Jillek, Investigations of interfacial reactions of Sn-Zn based and Sn-Ag-Cu lead-free solder alloys as replacement for Sn-Pb solder. J. Alloys Compd. 400, 136–144 (2005)

3. Y. Fujiwara, H. Enomoto, T. Nagao, H. Hoshika, Composite plating of Sn-Ag alloys for Pb-free soldering. Surf. Coat. Technol. 169, 100–103. (2003)

4. N.D. Lu, D.H. Yang, L.L. Li, Interfacial reaction between Sn-Ag-Cu solder and Co-P films with various microstructures. Acta Mater 61, 4581–4590 (2013)

5. C.H. Wang, C.C. Wen, C.Y. Lin, Solid-state interfacial reactions of Sn and Sn-Ag-Cu solders with an electroless Co(P) layer deposited on a Cu substrate. J. Alloys Compd. 662, 475–483 (2016)

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of the ultrasonic-assisted soldering on the interfacial reaction and IMC growth behavior of SAC305 solder with Cu alloy substrates;Journal of Materials Science: Materials in Electronics;2023-07

2. Numerical and experimental study on laser soldering process of SnAgCu lead-free solder;Materials Chemistry and Physics;2021-11

3. Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing;Materials;2021-02-07

4. Effects of the surface roughness on wetting properties and interfacial reactions between SAC305 solder and Cu substrate with Ni–W–P coating;Journal of Materials Science: Materials in Electronics;2020-07-28

5. Effect of Doped Nano-Ni on Microstructure Evolution and Mechanical Behavior of Sn-3.0Ag-0.5Cu (SAC305)/Cu-2.0Be Solder Joint during Isothermal Aging;Journal of Materials Engineering and Performance;2020-05

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3