Reliability of Sn–Ag–Sb lead-free solder joints
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference23 articles.
1. Lead-free Solders in Microelectronics
2. The effect of soldering process variables on the microstructure and mechanical properties of eutectic Sn-Ag/Cu solder joints
3. Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys
4. Microstructure evolution of eutectic Sn-Ag solder joints
5. Study on microstructure and shear strength of Sn–Ag–Sb solder joints;Lee,2001
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2. Effects of Sb on the properties and interfacial evolution of SAC305-2Bi-xSb/Cu solder joints;Journal of Materials Research and Technology;2024-05
3. Effect of Sb Addition on Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Ball Joints;Key Engineering Materials;2023-12-05
4. Effect of temperature on the low cycle fatigue properties of BGA solder joints;Microelectronics Reliability;2023-07
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