Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference23 articles.
1. Heat Resistance of Sn–9Zn Solder/Cu Interface with or without Coating
2. Interface Reaction and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu Joints
3. Training Course on Manufacturing Green Electronics;Jillek,2003
4. Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni–P by the molten Sn3.5Ag0.5Cu solder alloy
5. Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging
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1. Effects of soldering temperature and preheating temperature on the properties of Sn–Zn solder alloys using wave soldering;Soldering & Surface Mount Technology;2024-07-04
2. Comprehensive investigation of oxidation behavior on ternary In–Zn–Sn lead-free solder electronic materials;Journal of Materials Science: Materials in Electronics;2024-07
3. Investigating the influence of rotating magnetic field (RMF) on intermetallic compound crystallization, thermal and mechanical properties in lead-free Sn-Ag-Cu solder alloys during solidification;Materials Today Communications;2024-06
4. Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu;Materials;2024-05-04
5. Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification;Journal of Electronic Materials;2024-04-10
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