Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni–P by the molten Sn3.5Ag0.5Cu solder alloy-Reference-Cited by-同舟云学术

Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni–P by the molten Sn3.5Ag0.5Cu solder alloy

Published:2003-12 Issue:12 Volume:43 Page:2031-2037
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Islam M.N,Chan Y.C,Sharif A,Alam M.O

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference19 articles.

2. Flip chip technology;Zakel,1995

3. Growth kinetics studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints;Chan;Mater. Sci. Eng. B,1998

4. Effect of intermetallic compounds on the shear fatigue of Cu/63Sn–37Pb solder joints;So;IEEE Trans. CMPT, Part B,1997

5. Growth kinetics of intermetallic compounds in chip scale package solder joint;Tu;Scripta Mater,2001

Cited by 44 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of non-standard SnAg surface finishes on properties of solder joints;Applied Surface Science Advances;2023-12

2. Comparative study of normal and thin Au/Pd/Ni(P) surface finishes with Sn–3.0Ag–0.5Cu solder joints under isothermal aging;Journal of Materials Science: Materials in Electronics;2021-09-06

3. Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface;Journal of Materials Science: Materials in Electronics;2019-08-08

4. Innovative Socketable and Surface-Mountable BGA Interconnections;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05

5. Comparative study of ENEPIG and thin ENEPIG as surface finishes for SAC305 solder joints;Journal of Materials Science: Materials in Electronics;2017-12-20