Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging-Reference-Cited by-同舟云学术

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Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging

Published:2005-02 Issue:2 Volume:34 Page:143-149
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Islam M. N.,Sharif Ahmed,Chan Y. C.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-005-0225-z.pdf

Reference16 articles.

1. R.J. Klein Wassink, Soldering in Electronics, 2nd ed. (Ayr, Scotland: Electrochemical Publications Ltd., 1997), p. 141.

2. J.H. Lau, Solder Joint Reliability—Theory and Application (New York: Van Nostrand Reinhold, 1991), pp. 236–243.

3. Y.C. Chan, A.C.K. So, and J.K.L. Lai, Mater. Sci. Eng. B 55, 5 (1998).

4. A.C.K. So, Y.C. Chan, and J.K.L. Lai, IEEE Trans. CMPT, Part B 20, 463 (1997).

5. D.R. Fear, H.S. Morgan, S.N. Burcheit, and J.H. Lau, The Mechanics of Solder Alloy Interconnects (New York: Van Nostrand Reinhold, 1994).

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