Composite plating of Sn–Ag alloys for Pb-free soldering-Reference-Cited by-同舟云学术

Composite plating of Sn–Ag alloys for Pb-free soldering

Published:2003-06 Issue: Volume:169-170 Page:100-103
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Fujiwara Y.,Enomoto H.,Nagao T.,Hoshika H.

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference12 articles.

1. Modern Electroplating;Zhang,2000

2. Japan Electronics and Information Technology Industries Association web site, http://it.jeita.or.jp/jhistory/english/information/pbfree/roadmap/html

3. Crystal Structure and Microstructure of Electrodeposited Sn-Ag Alloys

4. Electrodeposition of Sn-Ag Alloys from Pyrophosphate Baths Containing Suspended Ag Nanoparticles.

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