Comparative study on the hourglass-like joint of electroplated Sn-base solder reinforced by adding Ag3Sn nanoparticles and Ag micro-alloying elements
Author:
Funder
China Aerospace Science and Technology Corporation
Publisher
Elsevier BV
Subject
General Materials Science
Reference43 articles.
1. Impact of packaging materials on reliability test for low-K wire bond-stacked flip chip CSP;Chen;J. Mater. Sci. Mater. Electron.,2009
2. Recent advances on electromigration in very-large-scale-integration of interconnects;Tu;J. Appl. Phys.,2003
3. Microelectronics Packaging Handbook;Rao,1997
4. Characteristics of current crowding in flip-chip solder bumps;Lai;Microelectron. Reliab.,2006
5. An analytical method to predict electromigration-induced finger-shaped void growth in SnAgCu solder interconnect;Yao;Scr. Mater.,2015
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Precipitation processes and phase interface structure of Ag3Sn during solidification of SnAg3Cu0.5/Cu solder joint;Vacuum;2024-01
2. Effect of the Solder Powder Size of Sn-Bi-Ag-In Lead-Free Solder on the Wettability and Microstructure of Cu Substrate;Materials Performance and Characterization;2023-06-16
3. Effects of Nanoparticle Addition on the Reliability of Sn-Based Pb-Free Solder Joints Under Various Conditions: A Review;Nano;2023-01
4. Improving thermal conductivity of polyvinylidene fluoride/low-melting-point alloy with segregated structure induced by incorporation of silver interface layer;Journal of Polymer Research;2022-08-17
5. Thermo-compression bonding process characteristics and shape control of Cu-pillar microbump joints by optimizing of solder melting;Journal of Materials Science: Materials in Electronics;2022-03-23
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3