Funder
National Natural Science Foundation of China
Natural Science Foundation of Hunan Province
State Key Laboratory of High Performance Complex Manufacturing
Innovation-Driven Project of Central South University
Fundamental Research Funds for Central Universities of the Central South University
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference24 articles.
1. .H.-M. Tong, Y.-S. Lai, C. Wong, Advanced flip chip packaging, (Springer, 2013).
2. .S. Lee, Fundamentals of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages, 3D Microelectronic Packaging (2017), pp. 157–203
3. .A. Yeoh, M. Chang, C. Pelto, T.-L. Huang, S. Balakrishnan, G. Leatherman, S. Agraharam, G. Wang, Z. Wang, D. Chiang, Copper die bumps (first level interconnect) and low-K dielectrics in 65nm high volume manufacturing, 56th Electronic Components and Technology Conference 2006, (IEEE, 2006), p. 5
4. .A. Eitan, K.-Y. Hung, Ieee, Thermo-compression Bonding for Fine-pitch Copper-pillar Flip-chip Interconnect - Tool Features as Enablers of Unique Technology, 2015 Ieee 65th Electronic Components and Technology Conference (2015), pp. 460–464
5. .S. Hwang, S.-K. Choi, Asme, Optimal design of thermo-compression bonding for advanced packaging system under uncertainty, (2020)
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