Fundamentals of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages
Author:
Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-319-44586-1_7
Reference33 articles.
1. S. Lee, Fundamental Study of Underfill Void Formation in Flip Chip Assembly (Georgia Institute of Technology, Atlanta, 2009)
2. S. Lee, R. Master, D.F. Baldwin, Assembly yields characterization of high I/O density, fine pitch flip chip in package using no-flow underfill. In Electronic Components and Technology Conference, Reno, 2007, p. 35
3. S. Lee, R. Master, D.F. Baldwin, Assembly yields characterization and failure analysis of Flip chip in package using no-flow underfill. In International Wafer Level Packaging Congress, 2007, pp. 169–175
4. S. Lee, R. Master, D.F. Baldwin, Void formation study of high I/O density, fine pitch flip chip in package using no-flow underfill. In Surface Mount Technology Association International, 2007, pp. 525–530
5. S. Lee et al., Void formation study of flip chip in package using no-flow underfill. IEEE Trans. Electron. Packag. Manuf. 31(4), 297–305 (2008)
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