1. Recent advances in nano-materials for packaging of electronic devices;S Y Zhang;J. Mater. Sci.-Mater. Electron,2019
2. Applicability Evaluation of Nano-Al 2 O 3 Modified Sn-Ag-Cu Solder in High-Density Electronic Packaging Subjected to Thermal Cycling;J Wu;Crystals,2022
3. Interfacial structures and mechanical properties of Cu/Sn/Cu containing SiC nanowires under transient liquid phase bonding;M L Li;Intermetallics,2022
4. Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints;H Z Wang;Materials Characterization,2020
5. Different Diffusion Behavior of Cu and Ni Undergoing Liquid-solid Electromigration;M L Huang;J. Mater. Sci. Technol,2014