Effect of Ni addition to the Cu substrate on the interfacial reaction and IMC growth with Sn3.0Ag0.5Cu solder-Reference-Cited by-同舟云学术

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Effect of Ni addition to the Cu substrate on the interfacial reaction and IMC growth with Sn3.0Ag0.5Cu solder

Published:2018-03-16 Issue:4 Volume:124 Page:
ISSN:0947-8396
Container-title:Applied Physics A
language:en
Short-container-title:Appl. Phys. A

Author:

Zhang Xudong,Hu Xiaowu,Jiang Xiongxin,Li Yulong

Funder

Nature Science Foundation of China

Nature Science Foundation of Jiangxi Province

Fund of the State Key Laboratory of Solidification Processing in NWPU

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science,General Chemistry

Link

http://link.springer.com/article/10.1007/s00339-018-1736-9/fulltext.html

Reference31 articles.

1. A. Wierzbicka-Miernik, K. Miernik, J. Wojewoda-Budka et al., Microstructure and chemical characterization of the intermetallic phases in Cu/(Sn,Ni) diffusion couples with various Ni additions. Intermetallics 59, 23–31 (2015)

2. H. Ma, A. Kunwar, R. Huang et al., Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag3Sn particles during multiple reflows. Intermetallics. 90, 90–96 (2017)

3. Y.M. A.S.M.A. Haseeb, M.M. Leong, Arafat In-situ alloying of Sn–3.5Ag solder during reflow through Zn nanoparticle addition and its effects on interfacial intermetallic layers. Intermetallics 54, 86–94 (2014)

4. L. Liu, Z. Chen, C. Liu, Y. Wu, B. An, Micro-mechanical and fracture characteristics of Cu6Sn5 and Cu3Sn intermetallic compounds under micro-cantilever bending. Intermetallics 76, 10–17 (2016)

5. C.H. Wang, H.T. Shen, Effects of Ni addition on the interfacial reactions between Sn–Cu solders and Ni substrate. Intermetallics 18, 616–622 (2010)

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1. Accelerated solid-liquid interdiffusion bonding of Cu joint using a Cu10Ni alloy mesh reinforced SAC305 composite solder;Journal of Materials Research and Technology;2024-03

2. Alteration of Cu3Sn growth and retention of multi-orientation Cu6Sn5 during thermal aging in Cu-xNi-yZn/Sn3.5Ag/Cu transient liquid-phase bonding;Materials Characterization;2024-01

3. Retaining multi-oriented and fine grain structure with Ni doping in Cu/Sn-3.0Ag-0.5Cu/Cu transient liquid phase bonding under isothermal aging treatment;Materials Chemistry and Physics;2023-09

4. Interconnection Performance of Copper Core Solder Joints in Ball-Grid-Array Package;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

5. Rapid formation, grain refinement and shear property of high-temperature-stable full IMC joints;Journal of Materials Research and Technology;2023-05

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