In-situ alloying of Sn–3.5Ag solder during reflow through Zn nanoparticle addition and its effects on interfacial intermetallic layers
Author:
Funder
High Impact Research
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry
Reference40 articles.
1. Modifying the mechanical properties of lead-free solder by adding iron and indium and using a lap joint test;Fallahi;J Mater Sci Mater Electron,2012
2. Nucleation control and thermal aging resistance of near-eutectic Sn–Ag–Cu–X solder joints by alloy design;Anderson;J Electron Mater,2009
3. Creep properties of composite solders reinforced with nano- and microsized particles;Shi;J Electron Mater,2007
4. Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy;Ahmed;Microelectron Reliab,2010
5. Effect of micron size Ni particle addition in Sn–8Zn–3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties;Billah;J Alloy Compd,2014
Cited by 35 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effects of cobalt nanoparticle on microstructure of Sn58Bi solder joint;Journal of Materials Science: Materials in Electronics;2023-01-25
2. Selective etching of lead-free solder alloys: A brief review;Materials Today Communications;2022-12
3. Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix;Journal of Materials Science: Materials in Electronics;2022-08-25
4. Growth mechanism and kinetics of Cu3Sn in the interfacial reaction between liquid Sn and diversely oriented Cu substrates;Journal of Materials Science: Materials in Electronics;2022-01-21
5. Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review;Materials & Design;2021-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3