Selective etching of lead-free solder alloys: A brief review-Reference-Cited by-同舟云学术

Selective etching of lead-free solder alloys: A brief review

Published:2022-12 Issue: Volume:33 Page:104520
ISSN:2352-4928
Container-title:Materials Today Communications
language:en
Short-container-title:Materials Today Communications

Author:

Yahaya Muhamad Zamri,Nazeri Muhammad Firdaus Mohd,Salleh Nor Azmira,Kurt Adem,Kheawhom Soorathep,Illés Balázs,Skwarek Agata,Abdullah Aboubakr M.,Mohamad Ahmad Azmin

Publisher

Elsevier BV

Subject

Materials Chemistry,Mechanics of Materials,General Materials Science

Reference72 articles.

1. Y. Wang, I.M. De Rosa, K. Tu, Size effect on ductile-to-brittle transition in Cu-solder-Cu micro-joints Elec. Com. C., IEEE, 2015, pp. 632–639.

2. Electro- and thermo-migration induced failure mechanisms in Package on Package

3. Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy

4. Effect Additions Zn on Sn-0.7 Cu Lead-Free Solder: A Short Brief;Tarmizi,2020

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