Size effect on ductile-to-brittle transition in Cu-solder-Cu micro-joints-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Size effect on ductile-to-brittle transition in Cu-solder-Cu micro-joints

Published:2015-05 Issue: Volume: Page:
ISSN:
Container-title:2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
language:
Short-container-title:

Author:

Wang Yaodong,De Rosa Igor M.,Tu K. N.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7133058/7159553/07159658.pdf?arnumber=7159658

Cited by 22 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Al particles addition on microstructure and shear properties of Cu/Sn-1Zn/Cu composite solder joints by transient liquid phase bonding;Materials Today Communications;2024-08

2. Research on technology and isothermal aging of double sided module convex interconnect;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

3. Microstructure and mechanical strength of Cu/Sn/Cu microbump via Ni and Zn doping into Cu substrate;Materials Chemistry and Physics;2023-04

4. Selective etching of lead-free solder alloys: A brief review;Materials Today Communications;2022-12

5. The effects of the decreasing joint size on interfacial microstructure and shear behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads;Journal of Materials Science: Materials in Electronics;2022-01

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP