Author:
Shi Yaowu,Liu Jianping,Yan Yanfu,Xia Zhidong,Lei Yongping,Guo Fu,Li Xiaoyan
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference18 articles.
1. H. Mavoori, S. Jin, J. Electron. Mater. 27, 1216 (1998)
2. K. Mohankumar and A.A.O. Tay (Proceedings of 6th Electronics Packaging Technology Conference, IEEE, 2004), pp. 455–461
3. J.L. Marshall, J. Calderon, J. Sees, G. Lucey, J.S. Hwang, IEEE Trans. Comp. Hybrids Manuf. Tech. 14, 698 (1991)
4. J.L. Marshall, J. Sees, and J. Calderon (Proceedings of the Technical Program, Nepcon West Conference, Anaheim, CA, 1992), pp. 1278–1283
5. H.S. Betrabet, S. McGee, J.K. McKinlay, Scripta Metall. Mater. 25, 2323 (1991)
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