Interfacial transfer and phase evolution between Cu and Sn solder doped with minor Cu, Ag and Ni: experimental and theoretical investigations
Author:
Funder
National Natural Science Foundation of China
Publisher
Springer Science and Business Media LLC
Subject
General Materials Science,General Chemistry
Link
https://link.springer.com/content/pdf/10.1007/s00339-020-03846-2.pdf
Reference53 articles.
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3. F. Xing, X.-M. Qiu, Y.-D. Li, Trans. Nonferrous Met. Soc. China 25, 879 (2015)
4. K.N. Tu, Y.-X. Liu, Mater. Sci. Eng. R 136, 1 (2019)
5. Q.-Y. Yin, F. Gao, Z.-Y. Gu, J.-R. Wang, E.A. Stach, G.-W. Zhou, Acta Mater. 125, 136 (2017)
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