Interface dynamics in one-dimensional nanoscale Cu/Sn couples-Reference-Cited by-同舟云学术

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Interface dynamics in one-dimensional nanoscale Cu/Sn couples

Published:2017-02 Issue: Volume:125 Page:136-144
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

Yin Qiyue,Gao Fan,Gu Zhiyong,Wang Jirui,Stach Eric A.,Zhou Guangwen

Funder

National Science Foundation under NSF Collaborative Research Award Grant

U.S. Department of Energy, Office of Basic Energy Sciences

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference26 articles.

1. Scalable synthesis and device integration of self-registered one-dimensional zinc oxide nanostructures and related materials;Nikoobakht;Chem. Soc. Rev.,2013

2. Review: developments in micro/nanoscale fabrication by focused ion beams;Kim;Vacuum,2012

3. Reflow and electrical characteristics of nanoscale solder;Gu;Small,2006

4. Well-aligned open-ended carbon nanotube architectures: an approach for device assembly;Zhu;Nano Lett.,2006

5. Nanowire joining methods;Li;Open Surf. Sci. J.,2011

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1. Influence behavior and mechanism of crystal orientation of Cu6Sn5 coating on interfacial intermetallic compounds growth in Sn-0.7Cu/Cu solder joint;Materials Characterization;2024-04

2. Insight into the improvement of service performance of Sn/Cu solder joint by Pt doping in Cu6Sn5 interfacial intermetallic compound;Materials Today Communications;2024-03

3. Interfacial diffusion and Kirkendall voids evolution in the Copper-Zinc alloy binary interface revealed by in situ transmission electron microscopy;Journal of Alloys and Compounds;2023-12

4. An in situ elemental migration on a nanosize Cu–Sn interface in a microscope;Journal of Materials Research and Technology;2023-09

5. Synthesis of Cu Nanowires by Template Electrodeposition and Their Application in Pressure Sensors;Journal of Electronic Materials;2023-03-12

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